
Moore’s Law might be sputtering, but Intel isn’t backing down. Their latest packaging tech stitches together chips like a high-tech quilt, cramming over 10,000 mm² of silicon into a single package, roughly the size of four credit cards side by side. Now bigger isn’t always better, as thermal management and interconnect bottlenecks remain hurdles, but Intel’s EMIB-T and reinforced heat spreaders show promise. If they pull this off, it could keep AI’s hunger for compute at bay, at least until the next breakthrough.
Top Stories This Week
- Intel Boasts Chip Package The Size Of A Dinner Plate
- Europe Launches €55m Project For Sustainable Semiconductors
- Just 10 Tech Companies Are Responsible For Half Of All Data Center Energy Consumption
- US Markets Stable As US And Chinese Officials Gather In London For Trade Talks
- Beijing Academy Introduces ‘RoboBrain’ AI Model To Power Humanoid Robots In China
- How To Optimize Laser Efficiency By Rounding Sharp Corners
- FBI Warns BADBOX 2.0 Malware Is Infecting Millions
- Toyota Has Built A Fully Functioning Japanese City To Use As A Laboratory
- AI Model Detects More Than 170 Types Of Cancer
- UVA’s Artificial Pancreas Uses ‘digital Twin’ Tech To Improve Diabetes Control
- Momentum Builds On RISC-V European Adoption
Hardware Business News
Europe Launches €55m Project For Sustainable Semiconductors

A €55 million initiative backed by the EU and Switzerland is aiming to overhaul how Europe makes chips, with sustainability baked in from the start. The Genesis project isn’t just about cutting emissions; it’s targeting raw material reuse, PFAS-free chemistries, and smarter waste handling across the entire supply chain. While many projects talk big and deliver little, this one brings together 58 serious players from industry and research. It’s refreshing to see a top-down effort that actually looks like it might deliver something practical, not just more paperwork.
Just 10 Tech Companies Are Responsible For Half Of All Data Center Energy Consumption

The latest ITU report paints a stark picture, just ten digital companies now account for over half of all data center energy use. AI, unsurprisingly, is a major driver, with emissions from top firms up 150% since 2020. The numbers are staggering, but not shocking. Efficiency gains like Google’s latest TPU are promising, yet the broader trend is clear: more data, more power. There’s nothing wrong with growth, but we’ve got to get honest about the cost, and smarter about how we handle it, before infrastructure or credibility cracks under the load.
US Markets Stable As US And Chinese Officials Gather In London For Trade Talks

Qualcomm’s acquisition of UK-based Alphawave is making headlines, not just for the $2.4 billion price tag, but because it marks yet another exit from London’s shrinking tech scene. While the deal gives Qualcomm a strategic boost in AI and 5G IP, it also underscores the UK market’s struggle to hold onto ambitious tech firms. Alphawave went public at more than double its current valuation, which says a lot about investor sentiment. Still, this is a solid fit for Qualcomm, and the IP grab could give them a sharper edge in the data center and networking race.
Beijing Academy Introduces ‘RoboBrain’ AI Model To Power Humanoid Robots In China

Beijing Academy’s RoboBrain 2.0 is setting a new standard for humanoid robotics with open-source AI that’s faster and more accurate. With 17% speed gains and 74% improved accuracy, it’s a serious step toward smarter, more capable robots. This model tackles real-world challenges like spatial awareness and task planning, and it’s part of a bigger ecosystem that China’s robotics industry is building aggressively. Despite geopolitical hurdles, the collaboration between institutes and companies shows China’s commitment to leading in robotics innovation, something the global tech community will be watching closely.
Hardware Engineering News
How To Optimize Laser Efficiency By Rounding Sharp Corners

If you’re working with laser cutting, you probably know every second counts, and yet, many overlook how much design impacts efficiency. Recently, I came across a study showing that rounding sharp corners and integrating slots into a continuous cut path slashed laser process time by nearly 30%. It’s not just about faster cutting; smoother moves also reduce wear and tear too. From my experience, these small but smart tweaks make a real difference without needing new gear or big budgets. It’s a practical reminder that good engineering isn’t just about complexity, but about thoughtful simplicity.
FBI Warns BADBOX 2.0 Malware Is Infecting Millions

The FBI’s recent alert about BADBOX 2.0 malware hitting millions of cheap smart devices is a stark reminder that convenience often comes with hidden costs. This malware, preloaded on many budget IoT gadgets, grants attackers backdoor access and makes removal a technical nightmare. While the allure of affordable tech is understandable, this situation underscores the need for cautious purchasing and stronger hardware vetting. As engineers, it’s a call to balance innovation with security, and never to overlook the risks lurking behind cut-rate gear.
Toyota Has Built A Fully Functioning Japanese City To Use As A Laboratory

Toyota’s Woven City is a rare breed of urban innovation, more than just smart tech, it’s a living lab where residents actively shape the future of city life. This blend of kaizen philosophy and cutting-edge IoT shows how real progress comes not from top-down planning, but from continuous feedback and iteration. Such feats of engineering remind us that smart design means staying adaptable and listening closely to users. Woven City’s lessons aren’t just for Japan, they’re a blueprint for all of us aiming to build more resilient, efficient, and human-centered urban environments.
Hardware R&D News
AI Model Detects More Than 170 Types Of Cancer

Tumor diagnosis has long relied on risky biopsies and slow lab work, but now an AI model called crossNN can classify over 170 cancer types with impressive accuracy, and it even works from liquid biopsies. As an engineer, I appreciate the elegance of using epigenetic fingerprints combined with machine learning, because it’s precise without being overly complicated. While I remain cautious about any tech hailed as a “game changer,” this method’s explainability and clinical promise make it worth watching. It’s a good reminder that sometimes, simpler designs deliver the most reliable results.
UVA’s Artificial Pancreas Uses ‘digital Twin’ Tech To Improve Diabetes Control

Managing Type 1 diabetes just got a tech upgrade with UVA’s artificial pancreas, which uses a “digital twin” to simulate a user’s unique sugar processing. This lets patients safely test insulin adjustments before making real changes, improving control without guesswork. From an engineering standpoint, I respect this practical use of adaptive modeling, it’s a solid example of human-machine collaboration without overcomplication. While it’s early days, such innovations show how personalized control systems can deliver real benefits, and that’s worth paying attention to in medical device engineering.
Open-Source Hardware News
Momentum Builds On RISC-V European Adoption

RISC-V’s momentum in Europe is undeniable, yet it’s clear that public funding alone won’t drive the industry forward. The open ISA has passed its tipping point, and with players like Infineon stepping up, commercial traction is real, but sustaining that growth demands smarter, industry-focused investment. Europe’s strength lies in its collaborative research, yet the gap between academic innovation and market-ready products remains a challenge. From where I stand, Europe must sharpen its funding strategy to ensure that promising RISC-V projects don’t just stay on paper but evolve into competitive products that can hold their own globally.